Introduction
Open, rough edges of chipboard are a well-known challenge in the industry. Due to the coarse and highly absorbent structure, it is difficult to apply an even and controlled coating layer during the chipboard edge sealing process.
Traditional techniques often lead to material waste, additional processing steps, and inconsistent quality. With TTEPS, Trivec offers an efficient and highly precise solution for chipboard edge sealing and edge coating applications.
The challenge: Rough and highly absorbent edges
Chipboard often has untreated edges with an open and coarse structure. This leads to:
- High absorption of coating, glue, or sealer
- Limited control over layer thickness
- No smooth base for further finishing
Without a proper initial sealing layer, the coating is immediately absorbed into the material, resulting in an uneven end result.
This makes consistent chipboard edge sealing difficult with traditional edge coating methods.
The solution: TTEPS precision application
TTEPS (Trivec Temperature Edge Precision Spraying) is developed to apply coating exactly where it is needed, without overspray.
This targeted application:
- minimizes material waste
- keeps the working environment cleaner
- provides maximum control over the process
In combination with an LED sealer and immediate curing, a good sealing layer is created in a single step. This makes TTEPS a highly efficient solution for precision spraying and chipboard edge sealing.
From rough edge to smooth surface
By structuring the process effectively:
- Pre-sanding the edge
- Precisely applying the sealer with TTEPS
- Immediate LED curing
a smooth and sealed surface is achieved, even on very rough chipboard edges.
This surface creates a stable base for further finishing steps, such as light sanding or top coating. Proper chipboard edge sealing also improves the final appearance and coating consistency of the product.
The benefits for your production process
Applying TTEPS for chipboard edge sealing offers several advantages:
- Consistent and repeatable quality
- Lower material consumption because coating is only applied where needed
- More efficient process with fewer steps
- Suitable for integration into existing production lines
In addition, this technology makes it possible to create a high-quality end product from a relatively low-cost base material.
With precise edge coating and controlled application, manufacturers can improve production efficiency while reducing coating waste.
Practical and scalable application
TTEPS technology can be used as a standalone solution or integrated into existing lines. This makes it suitable for both new production setups and optimization of current processes.
The scalability of this chipboard edge sealing solution allows manufacturers to maintain quality while increasing production capacity.
Learn more about TTEPS
Want to dive deeper into the technology and possibilities?
Visit our product page: https://trivec.eu/producten/tteps-edge-coater/
Would you like to test this yourself?
In our Experience Center, we test your material and application together. This allows us to determine the best setup for your specific production process.
Would you like to know if TTEPS is suitable for your situation?
Feel free to contact us. We are happy to help.
